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Call for pricing!
- Laser cut Stencils (Framed)
- Alternative to Electroform Stencils
- QTS Stencils
- Laser cut Stencils (Foil only)
- BGA Stencils
- Stainless Steel from .003 to .025 mils thick
- Delivery- When you need! 6 hrs to 3 day turn
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We offer to all new customers,
half price on any first stencil....just for trying Alternative
Solutions, Inc. We are dedicated to you!!!
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ASI has taken the electronics market by
storm regarding superb quality, pricing and delivery of laser
cut stencils. We use unique processes that allow us to give you
perfect paste release, fiducials that do not disappear into your
process, on time delivery and as always, quality, quality,
quality! Our accuracy is unsurpassed and has eliminated the need
for incoming inspection with 90% of our customers. Our stencils
save process time, money and headaches. Come join the ASI
team of knowledge, quality, pricing and delivery. See why the
rest of the electronics industry puts their trust in ASI
Laser Cut Stencils!
- The growing trend is toward increased use of fine pitch
technology. FPT presents problems for the manufacturers of
solder paste stencils. The conventional
photo-chemical-etching (PCE) method of producing these
stencils is flawed with several inherent obstacles to
meeting the demand for ever smaller features and finer
pitches. These obstacles disappear with proper laser
cutting.
- Laser cut stencils in stainless steel allow a process
window for today's quality requirements. Quality fine pitch
printing offers no other affordable choice than the use of
laser cut stencils...Your yield and process dictate this.
Laser cut stencils are produced by using origional PCB data
sent by Email, floppy disk or FTP.
- ASI laser processing produces slots of less than
.004" in adequately thick materials, with excellent edge
quality and complete consistency in every orientation.
- ASI laser processing produces straight-sided
features and cuts with positive taper that
facilitate clean and accurate release.
- ASI laser processing achieves positional
accuracies of better than .001" over the entire screen area,
no hazardous materials are used, and no chemical waste is
produced.
- ASI laser processing cuts slots with more than
4:1 depth-to-feature-size ratio and with unsurpassed
accuracy.
- Laser cutting produces the high-aspect ratio cuts needed
for the small feature, fine pitch technology developments of
today and tomorrow.
- ASI can process stainless steel foils from 0.1mm
to 0.3mm thick (0.004" to 0.012"), assuring ample deposits
of paste, even with pad sizes as small as 0.1mm X 0.1mm
(0.004" X 0.004"). And, cuts are programmed with slightly
rounded corners for easy, accurate release.
- Laser cutting produces edges that are clean and sharp
with none of the rounding that can occur with
micro-polishing. This means clean, easy no-stick release.
- No artwork need be generated, and the usual artwork
errors and the need for micro-modification are avoided.
Patterns can be checked before cutting starts, and the
design can be electronically stored for precise
repeatability on replacement stencils that may be ordered
months after the first ones are produced.
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BGA Rework Do you need
specialized Ball Grid Array stencils?
ASI is highly experienced in the design and
production of BGA stencils for both solder paste
and re-balling. Call us and discuss your requirements. |
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